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SANTA CLARA, Calif., October 19, 2021 (GLOBE NEWSWIRE) – H-Square Corporation, a leading supplier of automated microelectronics manufacturing and handling equipment, is refining its market focus to develop new technologies in key areas of robotics, automation and intelligent software tools. This effort is led by the company’s seasoned management team: Helen Lin, CEO; Steve Hausle, vice president of sales and marketing; Myron Moreno, Managing Director; and Karl Gartland, responsible for product development and engineering.
H-Square recently shipped several units of its WS300M automatic wafer moving / sorting device for 300mm wafers, which can process 200 wafers per hour. Currently, the company is developing a customized version of the robotics-based system for a leading semiconductor equipment manufacturer that is currently pursuing a new role as a foundry for the burgeoning virtual reality (VR) market. The WS300M and other products, such as the company’s 300mm Bernoulli non-contact handheld tools, have enabled H-Square to tap into the 300mm space.
“H-Square has long been known for its industry standard wafer processing technology. Our products can be found in virtually every substrate manufacturing facility around the world, ”said Lin. “Now we are on the cusp of a new era, seeking to develop new innovative solutions that leverage our proven expertise, while continuing to provide the wafer and substrate processing products that our customers know and are familiar with. they trust for existing and emerging markets. “
A primary focus of H-Square’s substrate processing business is the growing compound semiconductor market, which is expected to grow by nearly US $ 12 billion between 2021 and 2025. Customers of this space using H-Square wafer processing technology sees as much as 95% less wafer breakage, and the company looks forward to building on its success in this and other markets it serves.
Hausle, whose previous experience includes senior positions within Corning, Inc.’s Precision Glass Solutions business, noted: damage or breakage. Our goal is to help the compound semiconductor industry transition to automated handling, just as we have done with the silicon industry in our 40 year history.
About H-SquareH-Square Corporation designs, develops and manufactures substrate handling tools for the microelectronics industry. Founded in 1975, H-Square has long been known as a trusted supplier of reliable and high quality automated and manual wafer handling equipment, as well as aligners, cassettes, photolithography tools and more. personalized products. www.hsquarecorp.com
Source: H-Square Corporation